DocumentCode
1498344
Title
Insulation enhancement with heat-shrinkable components
Author
Hoffman, John W.
Author_Institution
Raychem Corp., Menlo Park, CA, USA
Volume
7
Issue
2
fYear
1991
Firstpage
33
Lastpage
38
Abstract
The basic performance requirements for heat-shrinkable components and the compounding and processing techniques that are used to meet these requirements are covered. The emphasis is on the electrical, mechanical, and environmental protection features of components for low-voltage (up to 1 kV) applications. The aim is to provide a fundamental understanding of the capabilities and applications of heat-shrinkable components for insulation enhancement and environmental protection of electrical systems. Cross-linking, polymer selection, compounding, manufacturing, sealants, installation, and product configurations are discussed.<>
Keywords
organic insulating materials; polymers; compounding; electrical systems; environmental protection; heat-shrinkable components; insulation enhancement; manufacturing; polymer selection; processing techniques; product configurations; sealants; Dielectric materials; Dielectrics and electrical insulation; Electric resistance; Plastic insulation; Polymers; Power cables; Power systems; Resistance heating; Stress control; Temperature;
fLanguage
English
Journal_Title
Electrical Insulation Magazine, IEEE
Publisher
ieee
ISSN
0883-7554
Type
jour
DOI
10.1109/57.75767
Filename
75767
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