Title :
Opportunities and Challenges for 3D Systems and Their Design
Author :
Emma, Philip ; Kursun, Eren
Author_Institution :
T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
Abstract :
This article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues.
Keywords :
circuit CAD; design for manufacture; design for testability; integrated circuit design; integrated circuit testing; 3D ICs; 3D systems; DFT issues; design-for-manufacture; system design; test challenges; Art; Assembly systems; Circuit testing; Costs; Integrated circuit testing; Lithography; Manufacturing; Moore´s Law; Packaging; System testing; 3D systems;
Journal_Title :
Design & Test of Computers, IEEE
DOI :
10.1109/MDT.2009.119
