• DocumentCode
    1498992
  • Title

    Errors in Projecting Gate Dielectric Reliability From Fowler–Nordheim Stress to Direct-Tunneling Operation

  • Author

    Nicollian, Paul E.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • Volume
    30
  • Issue
    11
  • fYear
    2009
  • Firstpage
    1185
  • Lastpage
    1187
  • Abstract
    The extrapolation of gate dielectric reliability of devices that are stressed in the Fowler-Nordheim (F-N) tunneling regime but operate in the direct-tunneling (D-T) region is analyzed using the time-dependent dielectric-breakdown power law model. Due to the differences in the slopes of the gate current versus voltage characteristics between F-N and D-T, the widely established practice of directly extrapolating the time to breakdown from stress to operating conditions is, in general, not rigorously correct. Reliability projections across a wide voltage space can have significant errors, and the operating voltage that a technology can safely sustain may be overestimated.
  • Keywords
    MOSFET; error analysis; extrapolation; semiconductor device breakdown; semiconductor device reliability; stress effects; tunnelling; Fowler-Nordheim stress; MOSFET devices; direct tunneling; error analysis; extrapolation; gate current-voltage characteristics; gate dielectric reliability projections; time-dependent dielectric-breakdown power law model; Breakdown; SiON; dielectric; oxide; reliability; time-dependent dielectric breakdown (TDDB);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2009.2030698
  • Filename
    5286211