DocumentCode
1498992
Title
Errors in Projecting Gate Dielectric Reliability From Fowler–Nordheim Stress to Direct-Tunneling Operation
Author
Nicollian, Paul E.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
Volume
30
Issue
11
fYear
2009
Firstpage
1185
Lastpage
1187
Abstract
The extrapolation of gate dielectric reliability of devices that are stressed in the Fowler-Nordheim (F-N) tunneling regime but operate in the direct-tunneling (D-T) region is analyzed using the time-dependent dielectric-breakdown power law model. Due to the differences in the slopes of the gate current versus voltage characteristics between F-N and D-T, the widely established practice of directly extrapolating the time to breakdown from stress to operating conditions is, in general, not rigorously correct. Reliability projections across a wide voltage space can have significant errors, and the operating voltage that a technology can safely sustain may be overestimated.
Keywords
MOSFET; error analysis; extrapolation; semiconductor device breakdown; semiconductor device reliability; stress effects; tunnelling; Fowler-Nordheim stress; MOSFET devices; direct tunneling; error analysis; extrapolation; gate current-voltage characteristics; gate dielectric reliability projections; time-dependent dielectric-breakdown power law model; Breakdown; SiON; dielectric; oxide; reliability; time-dependent dielectric breakdown (TDDB);
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2009.2030698
Filename
5286211
Link To Document