DocumentCode
1499038
Title
Clustered defects in IC fabrication: Impact on process control charts
Author
Friedman, David J. ; Albin, Susan L.
Author_Institution
AT&T Bell Labs., Murray Hill, NJ, USA
Volume
4
Issue
1
fYear
1991
fDate
2/1/1991 12:00:00 AM
Firstpage
36
Lastpage
42
Abstract
In IC fabrication, standard process control charts for defects often sound many false alarms, i.e. the chart incorrectly indicates that the process is out of control. It is pointed out that when non-Poisson behavior is encountered in defect data, it is necessary to determine whether this is due to an out-of-control manufacturing process or a manufacturing or data collection procedure that yields clustered defect counts. A procedure that includes the outlier removal method to discriminate between clustered defect data and a process that is out of control is proposed, and its application to two sets of real-world data is shown. One is an example from IC manufacturing where true clustering exists, and the other is a manufacturing example where persistent out-of-control conditions give the appearance of clustering. Simulation results indicate that the procedure works well within reasonable boundaries. A method for constructing defect control charts for processes that yield clustered defects is also presented
Keywords
integrated circuit manufacture; statistical process control; IC fabrication; Impact on process control charts; appearance of clustering; clustered defect counts; clustered defect data; constructing defect control charts; false alarms; persistent out-of-control conditions; processes that yield clustered defects; real-world data; standard process control charts; Acoustical engineering; Computer industry; Control charts; Fabrication; Helium; Industrial control; Job shop scheduling; Manufacturing processes; Process control; Time measurement;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.75850
Filename
75850
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