• DocumentCode
    1499061
  • Title

    Radiation thermometry of silicon wafers in a diffusion furnace for fabrication of LSI

  • Author

    Watanabe, Tomoji ; Torii, Takuji ; Hirasawa, Shigeki ; Takagaki, Tetsuya

  • Author_Institution
    Hitachi Ltd., Ibaraki, Japan
  • Volume
    4
  • Issue
    1
  • fYear
    1991
  • fDate
    2/1/1991 12:00:00 AM
  • Firstpage
    59
  • Lastpage
    63
  • Abstract
    A radiation thermometry technique suitable for measuring the temperature of silicon wafers in a diffusion furnace has been developed. A principal feature of this technique is that it measures the temperature of wafers that are not in the line of sight of a conventional pyrometer. An optical guide, consisting of two quartz prisms, gives optical access to interior wafers in the load. A measuring wavelength of 0.9 μm is selected since a silicon wafer is opaque and its emissivity does not depend on temperature at this wavelength. The accuracy of the thermometry is examined by comparing the measured value of the pyrometer with that of a thermocouple. The two measured values agree within ±2°C in a steady state. When wafers are being inserted into or drawn out from the furnace, however, an error is caused by the veiling glare at the optical guide and the wafer
  • Keywords
    integrated circuit manufacture; large scale integration; pyrometers; semiconductor technology; 0.9 micron; Si wafers; SiO2 prisms; diffusion furnace; fabrication of LSI; interior wafers; measuring wavelength; optical guide; quartz prisms; radiation thermometry technique; veiling glare; wafer temperature measurement; Annealing; Fabrication; Furnaces; Heating; Impurities; Large scale integration; Pollution measurement; Silicon; Temperature measurement; Wavelength measurement;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.75853
  • Filename
    75853