DocumentCode
1499061
Title
Radiation thermometry of silicon wafers in a diffusion furnace for fabrication of LSI
Author
Watanabe, Tomoji ; Torii, Takuji ; Hirasawa, Shigeki ; Takagaki, Tetsuya
Author_Institution
Hitachi Ltd., Ibaraki, Japan
Volume
4
Issue
1
fYear
1991
fDate
2/1/1991 12:00:00 AM
Firstpage
59
Lastpage
63
Abstract
A radiation thermometry technique suitable for measuring the temperature of silicon wafers in a diffusion furnace has been developed. A principal feature of this technique is that it measures the temperature of wafers that are not in the line of sight of a conventional pyrometer. An optical guide, consisting of two quartz prisms, gives optical access to interior wafers in the load. A measuring wavelength of 0.9 μm is selected since a silicon wafer is opaque and its emissivity does not depend on temperature at this wavelength. The accuracy of the thermometry is examined by comparing the measured value of the pyrometer with that of a thermocouple. The two measured values agree within ±2°C in a steady state. When wafers are being inserted into or drawn out from the furnace, however, an error is caused by the veiling glare at the optical guide and the wafer
Keywords
integrated circuit manufacture; large scale integration; pyrometers; semiconductor technology; 0.9 micron; Si wafers; SiO2 prisms; diffusion furnace; fabrication of LSI; interior wafers; measuring wavelength; optical guide; quartz prisms; radiation thermometry technique; veiling glare; wafer temperature measurement; Annealing; Fabrication; Furnaces; Heating; Impurities; Large scale integration; Pollution measurement; Silicon; Temperature measurement; Wavelength measurement;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.75853
Filename
75853
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