Frequency-dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems

Author

Cangellaris, Andreas C. ; Prince, John L. ; Vakanas, Loizos P.

Author_Institution

Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA

Volume

13

Issue

1

fYear

1990

fDate

3/1/1990 12:00:00 AM

Firstpage

154

Lastpage

159

Abstract

Frequency-dependent inductances and resistances of three-dimensional structures commonly encountered in modern electronic interconnections are calculated by a combined finite-element/integral-equation method. the mathematical formulation and the numerical method of solution are discussed. Numerical results for microstrip bends and vias are presented. These results compare well with experiment. The effect of the frequency dependence of the inductance on pulse propagation is discussed

Keywords

VLSI; inductance; strip lines; combined finite-element/integral-equation method; electronic interconnections; frequency dependent inductance; frequency dependent resistance; high-speed interconnect systems; mathematical formulation; microstrip bends; numerical method of solution; pulse propagation; three-dimensional structures; vias; Complex networks; Equivalent circuits; Finite element methods; Frequency dependence; Inductance; Integrated circuit interconnections; Manufacturing; Microstrip; Shape; Strips;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.52864

Filename

52864