Simulation of transients in VLSI packaging interconnections

Author

Palusinski, Olgierd A. ; Liao, J.C. ; Prince, John L. ; Cangellaris, Andreas C.

Author_Institution

Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA

Volume

13

Issue

1

fYear

1990

fDate

3/1/1990 12:00:00 AM

Firstpage

160

Lastpage

166

Abstract

An approach to electrical analysis of VLSI packaging interconnections using computer simulation is presented. The corresponding simulation software developed during the course of research on VLSI interconnections conducted at the University of Arizona is described. Examples of application to prototypical interconnections (two transmission line systems joined by a lumped parameter network of bipolar and MOS transistors) are provided. The simulation results for the above examples are presented and analyzed. The current status of the work is discussed and directions of future research delineated

Keywords

VLSI; circuit analysis computing; packaging; transients; University of Arizona; VLSI packaging interconnections; computer simulation; electrical analysis; simulation results; transients simulation; transmission line systems; Application software; Computational modeling; Computer simulation; MOSFETs; Packaging; Power system transients; Prototypes; Software prototyping; Transmission lines; Very large scale integration;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.52865

Filename

52865