DocumentCode :
1499926
Title :
SOI Substrate Removal for SEE Characterization: Techniques and Applications
Author :
Shaneyfelt, Marty R. ; Schwank, James R. ; Dodd, Paul E. ; Stevens, Jeffrey ; Vizkelethy, Gyorgy ; Swanson, Scot E. ; Dalton, Scott M.
Author_Institution :
Sandia National Laboratories, Albuquerque, NM, USA
Volume :
59
Issue :
4
fYear :
2012
Firstpage :
1142
Lastpage :
1148
Abstract :
Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated.
Keywords :
Contamination; Etching; Gold; Silicon; Substrates; Testing; Heavy-ion testing; laser testing; microbeam testing; substrate removal;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2012.2189247
Filename :
6187678
Link To Document :
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