• DocumentCode
    1499926
  • Title

    SOI Substrate Removal for SEE Characterization: Techniques and Applications

  • Author

    Shaneyfelt, Marty R. ; Schwank, James R. ; Dodd, Paul E. ; Stevens, Jeffrey ; Vizkelethy, Gyorgy ; Swanson, Scot E. ; Dalton, Scott M.

  • Author_Institution
    Sandia National Laboratories, Albuquerque, NM, USA
  • Volume
    59
  • Issue
    4
  • fYear
    2012
  • Firstpage
    1142
  • Lastpage
    1148
  • Abstract
    Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated.
  • Keywords
    Contamination; Etching; Gold; Silicon; Substrates; Testing; Heavy-ion testing; laser testing; microbeam testing; substrate removal;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2012.2189247
  • Filename
    6187678
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1499926