DocumentCode :
1500086
Title :
Moisture ingress into organic laminates
Author :
Pecht, Michael G. ; Ardebili, Haleh ; Shukla, Anand A. ; Hagge, John K. ; Jennings, David
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
Volume :
22
Issue :
1
fYear :
1999
fDate :
3/1/1999 12:00:00 AM
Firstpage :
104
Lastpage :
110
Abstract :
The electronic industry´s most common laminates (FR-4, HTFR-4, PI, CE, and BT) were investigated for their equilibrium levels of moisture and diffusion rates and monitored for their moisture content as a function of electrical capacitance. Isothermal sorption tests were performed on the laminates to find the equilibrium moisture content in each laminate at various environmental conditions. The moisture content of each laminate was evaluated as a function of electrical capacitance via a capacitance monitoring plate attached to each laminate. A model was developed to assess the equilibrium content as a function of both temperature and humidity. Data from the sorption-time experiments was used to evaluate a diffusion coefficient for each laminate. The Fickian model was used to facilitate the evaluation. The results of the laminate moisture content analyses were subsequently applied to a printed wiring board (PWB) with a capacitor plate on each of its laminates. The capacitance method of moisture measurement in PWB shows slower moisture ingress than the theoretical moisture diffusion based on laminate experiments
Keywords :
capacitance; diffusion; laminates; moisture; organic compounds; sorption; BT; CE; FR-4; Fickian model; HTFR-4; PI; diffusion coefficient; electrical capacitance; equilibrium moisture content; isothermal sorption; moisture ingress; organic laminate; printed wiring board; Capacitance; Electronics industry; Humidity; Isothermal processes; Laminates; Moisture; Performance evaluation; Temperature; Testing; Wiring;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.759359
Filename :
759359
Link To Document :
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