Title :
Collimating diode laser beams from a large-area VCSEL-array using microlens array
Author :
Hao-Lin Chen ; Francis, Daniel ; Nguyen, Thin ; Wupen Yuem ; Gabriel Li ; Chang-Hasnian, C.
Author_Institution :
Lawrence Livermore Nat. Lab., CA, USA
fDate :
5/1/1999 12:00:00 AM
Abstract :
We demonstrate the fabrication and bonding of a 1 cm×1 cm monolithic two dimensional (2D) vertical-cavity surface-emitting laser (VCSEL) array. We coupled the array to a matched microlens array to individually collimate light from each laser. We found the beam divergence of the collimated array to be 1.6/spl deg/ (1/e2) for the entire array. Using a 1-cm diameter F2 lens, we were able to focus the collimated beams to a spot of 400 μm in diameter and to couple more than 75% of the array power into a 1-mm core fiber. Our results show that it is possible to uniformly bond large area VCSEL arrays to heat sinks, and to collimate light from each element into parallel beams using a single 2-D microlens array. Our results also show that the brightness of the focused beam can be further increased with a lens to near 105-W/cm2 Steradian, a level that is useful for many high-power applications.
Keywords :
brightness; heat sinks; integrated optics; integrated optoelectronics; laser arrays; laser cavity resonators; optical collimators; optical fabrication; optical focusing; quantum well lasers; semiconductor technology; surface emitting lasers; 1 cm; 1 mm; 2D VCSEL array; 400 mum; F2 lens; Steradian; array power; beam divergence; bonding; brightness; collimate light; collimated beam focusing; collimating diode laser beams; heat sinks; high-power applications; large area VCSEL arrays; large-area VCSEL-array; matched microlens array; microlens array; optical collimators; parallel beams; single 2-D microlens array; uniformly bond; Bonding; Collimators; Diode lasers; Laser beams; Lenses; Optical arrays; Optical coupling; Semiconductor laser arrays; Surface emitting lasers; Vertical cavity surface emitting lasers;
Journal_Title :
Photonics Technology Letters, IEEE