Title :
Brazing to low-temperature-fired thick films
Author :
Keusseyan, Roupen L.
Author_Institution :
Dupont Electron., Research Triangle Park, NC, USA
fDate :
3/1/1990 12:00:00 AM
Abstract :
The development of materials and processes for brazing leads, pins, and heat sinks to alumina ceramic substrates is presented. The substrates are metallized using either copper-, silver-, or gold-based thick-film pastes that are fired in the 850-950°C temperature range. The metal ceramic joint strengths obtained are comparable to those achieved using high-temperature fired tungsten- or molybdenum-based metallizations
Keywords :
alumina; brazing; ceramics; heat sinks; hybrid integrated circuits; integrated circuit technology; packaging; substrates; thick film circuits; 850 to 950 C; Ag thick film paste; Al2O3 ceramic substrates; Au thick film paste; Cu thick film paste; PGA; brazing; development of materials; heat sinks; leads; low-temperature-fired thick films; metal ceramic joint strengths; metallizations; pin grid array; pins; temperature range; Atmosphere; Ceramics; Filler metals; Heat sinks; Inorganic materials; Lead; Metallization; Pins; Substrates; Thick films;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
