DocumentCode :
1500858
Title :
MEMS Capacitive Accelerometer-Based Middle Ear Microphone
Author :
Young, Douglas J. ; Zurcher, M.A. ; Semaan, M. ; Megerian, C.A. ; Ko, Wen H.
Author_Institution :
Dept. of Electr. & Comput. Eng. & the Dept. of Bioeng., Univ. of Utah, Salt Lake City, UT, USA
Volume :
59
Issue :
12
fYear :
2012
Firstpage :
3283
Lastpage :
3292
Abstract :
The design, implementation, and characterization of a microelectromechanical systems (MEMS) capacitive accelerometer-based middle ear microphone are presented in this paper. The microphone is intended for middle ear hearing aids as well as future fully implantable cochlear prosthesis. Human temporal bones acoustic response characterization results are used to derive the accelerometer design requirements. The prototype accelerometer is fabricated in a commercial silicon-on-insulator (SOI) MEMS process. The sensor occupies a sensing area of 1 mm × 1 mm with a chip area of 2 mm × 2.4 mm and is interfaced with a custom-designed low-noise electronic IC chip over a flexible substrate. The packaged sensor unit occupies an area of 2.5 mm × 6.2 mm with a weight of 25 mg. The sensor unit attached to umbo can detect a sound pressure level (SPL) of 60 dB at 500 Hz, 35 dB at 2 kHz, and 57 dB at 8 kHz. An improved sound detection limit of 34-dB SPL at 150 Hz and 24-dB SPL at 500 Hz can be expected by employing start-of-the-art MEMS fabrication technology, which results in an articulation index of approximately 0.76. Further micro/nanofabrication technology advancement is needed to enhance the microphone sensitivity for improved understanding of normal conversational speech.
Keywords :
accelerometers; bioMEMS; bioacoustics; biomedical electronics; biomedical equipment; bone; capacitive sensors; cochlear implants; ear; elemental semiconductors; integrated circuits; lab-on-a-chip; microfabrication; microphones; microsensors; silicon; silicon-on-insulator; speech; MEMS capacitive accelerometer-based middle ear microphone; MEMS characterization; MEMS design; MEMS implementation; SOI; Si; accelerometer design requirements; articulation index; commercial silicon-on-insulator MEMS process; custom-designed low-noise electronic IC chip; frequency 150 Hz to 8 kHz; human temporal bones acoustic response characterization; implantable cochlear prosthesis; microelectromechanical systems; microfabrication technology advancement; microphone sensitivity; middle ear hearing aids; nanofabrication technology advancement; normal conversational speech; packaged sensor unit; sensing area; sound pressure level detection; start-of-the-art MEMS fabrication technology; umbo; Accelerometers; Bones; Ear; Micromechanical devices; Microphones; Sensors; Vibrations; Implantable microphone; microelectromechanical systems (MEMS) accelerometer; middle ear hearing aid; middle ear microphone; Accelerometry; Biomedical Engineering; Ear, Middle; Electronics, Medical; Equipment Design; Hearing Aids; Humans; Implants, Experimental; Micro-Electrical-Mechanical Systems;
fLanguage :
English
Journal_Title :
Biomedical Engineering, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9294
Type :
jour
DOI :
10.1109/TBME.2012.2195782
Filename :
6188517
Link To Document :
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