Title :
Data mining of printed-circuit board defects
Author :
Kusiak, Andrew ; Kurasek, Christian
Author_Institution :
Dept. of Ind. Eng., Iowa Univ., Iowa City, IA, USA
fDate :
4/1/2001 12:00:00 AM
Abstract :
This paper discusses an industrial case study in which data mining has been applied to solve a quality engineering problem in electronics assembly. During the assembly process, solder balls occur underneath some components of printed circuit boards. The goal is to identify the cause of solder defects in a circuit board using a data mining approach. Statistical process control and design of experiment approaches did not provide conclusive results. The paper discusses features considered in the study, data collected, and the data mining solution approach to identify causes of quality faults in an industrial application
Keywords :
assembling; data mining; design of experiments; printed circuit manufacture; quality control; statistical process control; PCB defects; SPC; assembly process; data mining; electronics assembly; experiment design; printed-circuit board defects; quality engineering; quality fault cause identification; solder balls; statistical process control; Assembly; Data engineering; Data mining; Electronics industry; Fault diagnosis; Industrial electronics; Mining industry; Printed circuits; Process control; Process design;
Journal_Title :
Robotics and Automation, IEEE Transactions on