DocumentCode
1501080
Title
Analysis of the Impacts of Signal Slew and Skew on the Behavior of Coupled RLC Interconnects for Different Switching Patterns
Author
Roy, Abinash ; Xu, Jingye ; Chowdhury, Masud H.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Chicago, Chicago, IL, USA
Volume
18
Issue
2
fYear
2010
Firstpage
338
Lastpage
342
Abstract
This paper presents an in-depth analysis of signal slew and skew variations in coupled inductive lines for different switching patterns. It is revealed that variations of rise/fall time and skew alter the behavior of coupled inductive lines under different switching patterns. We observe that crosstalk noise reduces with increasing signal skew, and the impact of skew variation on crosstalk noise is more prominent for lines with strong capacitive coupling. A performance comparison is done between power supply and ground line as inductive shield, and it is found that ground lines work better than power lines in inductive crosstalk minimization. The 100%-delay measurement technique has been proposed as opposed to the conventional 50%-delay method, and we notice that the 50%-delay technique underestimates the propagation delay for an inductive dominant line with varying signal slew times. Closed-form equations for propagation delay in terms of signal slew time have been derived, which are within 9% of HSPICE-simulated results for a set of interconnect structures. These expressions are simple, and accuracy increases with growing number of interconnect lines.
Keywords
crosstalk; delays; integrated circuit interconnections; integrated circuit noise; capacitive coupling; closed-form equations; coupled RLC interconnects; coupled inductive lines; crosstalk noise; delay measurement technique; in-depth analysis; inductive crosstalk minimization; inductive dominant line; interconnect structures; power lines; propagation delay; signal slew time; skew variation; switching patterns; Capacitive and inductive coupling; signal rise and fall times; skew variation; switching patterns;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2008.2011911
Filename
5288543
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