Title :
Radiation Hardening by Applying Substrate Bias
Author :
Hu, Zhiyuan ; Liu, Zhangli ; Shao, Hua ; Zhang, Zhengxuan ; Ning, Bingxu ; Chen, Ming ; Bi, Dawei ; Zou, Shichang
Author_Institution :
Shanghai Inst. of Microsyst. & Inf. Technol., Chinese Acad. of Sci., Shanghai, China
fDate :
6/1/2011 12:00:00 AM
Abstract :
A reverse substrate bias is known to increase the threshold voltage and reduce the off-state leakage current, which is of great interest from a radiation perspective in space applications. In this work, substrate biases during both irradiation and post-irradiation test on the impacts of total ionizing dose effects in a 180 nm CMOS technology are studied. The results indicate that a negative substrate bias during irradiation impairs the radiation hardness while a negative substrate bias during post-irradiation test improves the radiation hardness for nMOS transistors. A simple model is proposed to discuss the net result including the both effects. We find that the substrate bias for radiation hardening does not always work in some special conditions, such as the device with very low body doping and the STI which is very sensitive to the electric field for the buildup of charge.
Keywords :
MOSFET; radiation hardening (electronics); CMOS technology; NMOS transistors; STI; electric field; off-state leakage current; post-irradiation test; radiation hardening; size 180 nm; substrate bias; Doping; Leakage current; Logic gates; Radiation effects; Radiation hardening; Substrates; Transistors; CMOS devices; radiation hardening; substrate bias; total ionizing dose effects;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2011.2138160