DocumentCode
1501565
Title
A new extrapolation law for data-retention time-to-failure of nonvolatile memories
Author
De Salvo, B. ; Ghibaudo, G. ; Pananakakis, G. ; Guillaumot, B. ; Candelier, P. ; Reimbold, G.
Author_Institution
Lab. de Phys. des Composants a Semicond., ENSERG, Grenoble, France
Volume
20
Issue
5
fYear
1999
fDate
5/1/1999 12:00:00 AM
Firstpage
197
Lastpage
199
Abstract
In this letter, we demonstrate that the commonly assumed Arrhenius law is inconsistent with extrapolation of data-retention time-to-failure of nonvolatile memories in highly accelerated life-tests. We argue that the retention time, namely log(t/sub H/), varies linearly with temperature T rather than with 1/T as commonly assumed, yielding an important reduction in the extrapolated time-to-failure. Extensive experimental results demonstrate the physical consistency of the new model. In particular, data-retention of EPROM devices and leakage current of interpoly dielectric and gate oxide have been investigated over a wide range of temperatures. Finally, it is shown that our model reconciles seemingly controversial activation energy data from the literature.
Keywords
EPROM; extrapolation; failure analysis; integrated circuit testing; integrated memory circuits; leakage currents; life testing; Arrhenius law; EPROM devices; activation energy data; data-retention time-to-failure; extrapolation law; gate oxide; highly accelerated life-tests; interpoly dielectric; leakage current; nonvolatile memories; physical consistency; Acceleration; Dielectric devices; Dielectric losses; EPROM; Extrapolation; Leakage current; Linear predictive coding; Microelectronics; Nonvolatile memory; Temperature distribution;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.761013
Filename
761013
Link To Document