• DocumentCode
    1501565
  • Title

    A new extrapolation law for data-retention time-to-failure of nonvolatile memories

  • Author

    De Salvo, B. ; Ghibaudo, G. ; Pananakakis, G. ; Guillaumot, B. ; Candelier, P. ; Reimbold, G.

  • Author_Institution
    Lab. de Phys. des Composants a Semicond., ENSERG, Grenoble, France
  • Volume
    20
  • Issue
    5
  • fYear
    1999
  • fDate
    5/1/1999 12:00:00 AM
  • Firstpage
    197
  • Lastpage
    199
  • Abstract
    In this letter, we demonstrate that the commonly assumed Arrhenius law is inconsistent with extrapolation of data-retention time-to-failure of nonvolatile memories in highly accelerated life-tests. We argue that the retention time, namely log(t/sub H/), varies linearly with temperature T rather than with 1/T as commonly assumed, yielding an important reduction in the extrapolated time-to-failure. Extensive experimental results demonstrate the physical consistency of the new model. In particular, data-retention of EPROM devices and leakage current of interpoly dielectric and gate oxide have been investigated over a wide range of temperatures. Finally, it is shown that our model reconciles seemingly controversial activation energy data from the literature.
  • Keywords
    EPROM; extrapolation; failure analysis; integrated circuit testing; integrated memory circuits; leakage currents; life testing; Arrhenius law; EPROM devices; activation energy data; data-retention time-to-failure; extrapolation law; gate oxide; highly accelerated life-tests; interpoly dielectric; leakage current; nonvolatile memories; physical consistency; Acceleration; Dielectric devices; Dielectric losses; EPROM; Extrapolation; Leakage current; Linear predictive coding; Microelectronics; Nonvolatile memory; Temperature distribution;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.761013
  • Filename
    761013