• DocumentCode
    1501612
  • Title

    High current density 800-V 4H-SiC gate turn-off thyristors

  • Author

    Li, B. ; Cao, L. ; Zhao, J.H.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
  • Volume
    20
  • Issue
    5
  • fYear
    1999
  • fDate
    5/1/1999 12:00:00 AM
  • Firstpage
    219
  • Lastpage
    222
  • Abstract
    4H-SiC gate turn-off thyristors (GTOs) were fabricated using the recently developed inductively-coupled plasma (ICP) dry etching technique. DC and ac characterisation have been done to evaluate forward blocking voltage, leakage current, on-state voltage drop and switching performance. GTOs over 800 V dc blocking capability has been demonstrated with a blocking layer thickness of 7 μm. The dc on-state voltage drops of a typical device at 25 and 300/spl deg/C were 4.5 and 3.6 V, respectively, for a current density of 1000 A/cm2. The devices can be reliably turned on and turned off under an anode current density of 5000 A/cm2 without observable degradation.
  • Keywords
    high-temperature electronics; silicon compounds; sputter etching; thyristors; wide band gap semiconductors; 4H-SiC gate turn-off thyristor; 800 V; SiC; current density; forward blocking voltage; high-temperature power device; inductively-coupled plasma dry etching; leakage current; on-state voltage drop; switching; Anodes; Current density; Dry etching; Fabrication; Low voltage; Plasma applications; Plasma density; Silicon carbide; Thermal conductivity; Thyristors;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.761020
  • Filename
    761020