DocumentCode :
1501707
Title :
Thermal Characterization of Junction in Solar Cell Packages
Author :
Jang, Sun Ho ; Shin, Moo Whan
Author_Institution :
Dept. of Mater. Sci. & Eng., Myongji Univ., Yongin, South Korea
Volume :
31
Issue :
7
fYear :
2010
fDate :
7/1/2010 12:00:00 AM
Firstpage :
743
Lastpage :
745
Abstract :
This is the first report on the direct measurement of the junction temperature and on the determination of thermal resistance of a commercial amorphous silicon (a-Si) solar cell package under real operating conditions. Thermal transient method was utilized for the thermal characterization. Irradiation of sunlight to the solar cell package was found to induce significant heat generation inside the solar cell package. It was shown that the driving of the solar cell package with a sun power of 1 sun (100 mW/cm2 and 1.5 AM) resulted in a junction temperature of about 113°C. Surprisingly, the temperature difference between the junction and the case surface of the solar cell package was as high as 43°C. The efficiency drop was observed with the increase of junction temperature in the solar cell package. Thermal resistance was determined under various operating conditions.
Keywords :
solar cells; thermal resistance; commercial amorphous silicon solar cell package; direct measurement; junction temperature; solar cell packages; thermal characterization; thermal resistance; thermal transient method; Junction temperature; solar cell; thermal resistance; thermal transient method;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2010.2048552
Filename :
5471188
Link To Document :
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