DocumentCode :
1501941
Title :
Multichip module photovoltaic miniarrays
Author :
Ortego, P.R. ; Bermejo, Sandra ; Castañer, Luis M.
Author_Institution :
Semicond. Devices Group, Univ. Politecnica de Catalunya, Barcelona, Spain
Volume :
24
Issue :
2
fYear :
2001
fDate :
5/1/2001 12:00:00 AM
Firstpage :
169
Lastpage :
174
Abstract :
In this work a novel concept of photovoltaic mini array assembly is described based on a flip-chip multichip module technology. A number of arrays composed of 15 series-connected 2 mm2 c-Si photovoltaic cells have been fabricated, achieving a packaging density of 40 cells/cm2. Measurements of the dark I-V characteristic confirmed that the resistive losses of the approach are small and do not degrade the electrical characteristics of the array. Nearly 0.5 mW/cm 2 delivered density power, and 7 V in open circuit conditions were typically measured under normalized solar spectrum (AM1.5 100 mW/cm 2), and around 6.3 mW/cm2 and 8.5 V using a 150 W commercial lamp placed at 5 cm distance from the panel
Keywords :
elemental semiconductors; flip-chip devices; losses; multichip modules; photovoltaic cells; silicon; 150 W; 7 V; 8.5 V; Si; dark I-V characteristic; electrical characteristics; flip-chip multichip module technology; normalized solar spectrum; packaging density; photovoltaic cells; photovoltaic mini array assembly; resistive losses; Assembly; Degradation; Electric variables; Electric variables measurement; Loss measurement; Multichip modules; Packaging; Photovoltaic cells; Photovoltaic systems; Solar power generation;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/6040.928751
Filename :
928751
Link To Document :
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