Analysis of the bounces on the power/ground plane structures by planar circuit model and APA-E algorithm

Author

Yang, Xiaoping ; Li, Zhengfan ; Mao, Junfa

Author_Institution

Shanghai Jiaotong Univ., China

Volume

24

Issue

2

fYear

2001

fDate

5/1/2001 12:00:00 AM

Firstpage

184

Lastpage

190

Abstract

In this paper, a novel effective numerical algorithm for analysis of the bounces on the power/ground-plane structure in printed circuit board (PCB) or multichip modules (MCMs) is proposed, which is based upon planar circuit model combined with APA-E algorithm. Firstly, the planar circuit model is developed to simulate the power/ground bounces when switching current is added in the structure. Secondly, on the basis of the abstract Pade approximant and the extrapolation algorithm, the APA-E algorithm is proposed. The classical multivariable rational Pade approximant is also constructed for comparison. Compared with finite difference time domain (FDTD) method, the new algorithm can provide a very accurate approximant in time domain, only requires little storage and CPU time. At last, attaching the decoupling capacitors for reducing the bounces on lossy power/ground-plane structures is also analyzed with this method

Keywords

circuit noise; extrapolation; multichip modules; printed circuit design; time-domain analysis; APA-E algorithm; abstract Pade approximant; bounces; decoupling capacitors; extrapolation algorithm; multichip modules; multivariable rational Pade approximant; numerical algorithm; planar circuit model; power/ground plane structures; printed circuit board; switching current; Algorithm design and analysis; Capacitors; Circuit simulation; Extrapolation; Finite difference methods; Joining processes; Multichip modules; Printed circuits; Switching circuits; Time domain analysis;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.928753

Filename

928753