DocumentCode :
1503126
Title :
A 1.0-ns/1.0-V Delay-Locked Loop With Racing Mode and Countered CAS Latency Controller for DRAM Interfaces
Author :
Lee, Hyun-Woo ; Choi, Hoon ; Shin, Beom-Ju ; Kim, Kyung-Hoon ; Kim, Kyung-Whan ; Kim, Jaeil ; Kim, Kwang-Hyun ; Jung, Jong-Ho ; Kim, Jae-Hwan ; Park, Eun-Young ; Kim, Jong-Sam ; Kim, Jong-Hwan ; Cho, Jin-Hee ; Rye, Namgyu ; Chun, Jun-Hyun ; Kim, Yunsaing
Author_Institution :
Hynix Semicond. Inc., Icheon, South Korea
Volume :
47
Issue :
6
fYear :
2012
fDate :
6/1/2012 12:00:00 AM
Firstpage :
1436
Lastpage :
1447
Abstract :
The digital delay-locked loop (DLL) with racing mode and the countered column address strobe (CAS) latency controller are proposed in this paper. The dual-DLL architecture with racing operation is adopted to achieve low power consumption, low jitter, fast locking, wide range of locking, and stuck-free control. The merged dual coarse delay line (MDCDL) reduces the dynamic power consumption of a variable delay line by 30% by sharing a part of the delay line path in DLL. In addition, jitter is reduced by 45 ps in the 1066-DDR3 operating mode by MDCDL. The proposed DLL utilizes an or-and functioned duty cycle corrector (or-and DCC), which consumes 15% of DLL´s power, 0.915 pJ/Hz at tCK=1.5 ns and VDD=1.575 V. The countered CAS latency controller (CCLC) saves IDD3N current because it does not need a DLL clock and does not need to be activated for IDD3N (active non-power down) state. The DLL clock is enabled and CCLC is activated only when the read command is issued. This operation condition saves the IDD3N current by 60% with the proposed DLL. The proposed DLL is employed in 128 M×8 DDR3 SDRAM and 64 M×16 DDR3 SDRAM. The former and the latter are fabricated by 5×nm and by 4× nm DRAM process technology, respectively. Experimental results show that ±10% duty error of the external clock can be corrected to within ±2% duty error in less than 512 cycles of locking time under 1.5 ns of tCK. The proposed DLL and CCLC can operate above 1.0-GHz operating frequency at 1.2 V in 5× nm DDR3 SDRAM and at 1.0 V in 4× nm DDR3 SDRAM, respectively. The proposed DLL fabricated with 4× nm technology consumes 6.1 pJ/Hz at 1.575 V.
Keywords :
DRAM chips; clocks; delay lock loops; low-power electronics; DDR3 SDRAM; DDR3 operating mode; DLL clock; DRAM interfaces; DRAM process technology; MDCDL; column address strobe; countered CAS latency controller; delay line path; delay locked loop; dual-DLL architecture; frequency 1.0 GHz; merged dual coarse delay line; or-and functioned duty cycle corrector; racing mode; read command; stuck-free control; voltage 1.0 V; voltage 1.2 V; voltage 1.575 V; Clocks; Delay; Delay lines; Logic gates; Mixers; Power demand; Random access memory; Column address strobe (CAS) latency controller; DDR3; DRAMs; IDD3N; IDD3P; OA-DCC; delay-locked loop (DLL); dual coarse delay line; duty cycle corrector (DCC); merged dual coarse delay line (MDCDL); or-and DCC;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2012.2191027
Filename :
6189759
Link To Document :
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