DocumentCode
1503304
Title
Scanning the issue - Interconnections - addressing the next challenge of IC technology (part II: design, characterization, and modeling)
Author
Schutt-Aine, J.E. ; Sung-Mo Kang
Author_Institution
University of Illinois at Urbana-Champaign
Volume
89
Issue
5
fYear
2001
fDate
5/1/2001 12:00:00 AM
Firstpage
583
Lastpage
585
Abstract
Provides an overview of the technical articles and features presented in this issue.
Keywords
Analytical models; Clocks; Crosstalk; Design automation; Design engineering; Fabrication; Integrated circuit interconnections; Integrated circuit modeling; Special issues and sections; Submillimeter wave technology;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/JPROC.2001.929645
Filename
929645
Link To Document