Study of tantalum oxide thin film capacitors on metallized polymer sheets for advanced packaging applications

Author

Chen, Ke ; Nielsen, Matt ; Soss, S. ; Rymaszewski, Eugene J. ; Lu, Toh-Ming ; Wan, C.T.

Author_Institution

Center for Integrated Electron. & Manuf., Rensselaer Polytech. Inst., Troy, NY, USA

Volume

20

Issue

2

fYear

1997

fDate

5/1/1997 12:00:00 AM

Firstpage

117

Lastpage

122

Abstract

Tantalum oxide thin film capacitors were fabricated on metallized polyimide sheet substrates and tested. It was found that the substrates´ surface topography has a strong influence on the electrical properties and yields of the thin film capacitors. The leakage current density and breakdown field strength of the capacitors are qualitatively correlated to the amount and degree of surface irregularities on the substrates, which were analyzed using scanning electron microscopy (SEM), atomic force microscopy (AFM), and profilometry. It was demonstrated that Benzocyclobutene (BCB) can be used to planarize the surface irregularities and to improve the capacitor yield and performance. The importance of choosing the right substrate materials for thin film capacitor fabrication is also discussed

Keywords

metallisation; packaging; polymer films; tantalum compounds; thin film capacitors; Ta₂O₅; atomic force microscopy; benzocyclobutene; breakdown field strength; decoupling capacitor; electrical properties; electronic packaging; fabrication; leakage current density; metallized polyimide sheet substrate; planarization; profilometry; scanning electron microscopy; surface topography; tantalum oxide thin film capacitor; yield; Atomic force microscopy; Capacitors; Leakage current; Metallization; Polyimides; Polymer films; Scanning electron microscopy; Substrates; Surface topography; Testing;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.575561

Filename

575561