DocumentCode :
1504023
Title :
Full-wave analysis of packaged microwave circuits with active and nonlinear devices: an FDTD approach
Author :
Kuo, Chien Nan ; Houshmand, Bijan ; Itoh, Tatsuo
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Volume :
45
Issue :
5
fYear :
1997
fDate :
5/1/1997 12:00:00 AM
Firstpage :
819
Lastpage :
826
Abstract :
This paper presents a comprehensive full-wave analysis of packaged nonlinear active microwave circuits by applying the extended finite-difference time-domain (FDTD) method. Based on the approach of using equivalent sources, the device-wave interaction is characterized and incorporated into the FDTD time-marching scheme. As a consequence, analysis of linear and nonlinear properties, including harmonic generation and intermodulation, can be accomplished by employing a large-signal device circuit model. The implementation is first validated by comparing results of FDTD and HP MDS simulation of the circuit without the packaging structure. The analysis then goes beyond the capability of the circuit simulator to include the packaging effect. This analysis is useful in circuit design involving electromagnetic compatibility/electromagnetic interference (EMC/EMI) problems
Keywords :
MMIC; electromagnetic compatibility; electromagnetic interference; finite difference time-domain analysis; integrated circuit design; integrated circuit modelling; integrated circuit packaging; intermodulation; FDTD approach; circuit design; device-wave interaction; electromagnetic compatibility/electromagnetic interference; equivalent sources; extended finite-difference time-domain method; full-wave analysis; harmonic generation; intermodulation; large-signal device circuit model; nonlinear active microwave circuits; packaged microwave circuits; packaging effect; time-marching scheme; Circuit simulation; Electromagnetic compatibility; Finite difference methods; Frequency conversion; Harmonic analysis; Microwave circuits; Microwave devices; Microwave theory and techniques; Packaging; Time domain analysis;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/22.575606
Filename :
575606
Link To Document :
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