Abstract :
Researchers from the National Changhua University of Education in Taiwan have proposed a built-in self-routing scheme for through-silicon vias (TSVs). The scheme, to be applied in three-dimensional integrated circuits (3D IC), improves repair rate, performance and reduces area overheads. As Moore´s law begins to reach its limits, 3D ICs are becoming increasingly important for industry, and efficient interconnections are essential for their development.
Keywords :
integrated circuit interconnections; maintenance engineering; network routing; three-dimensional integrated circuits; 3D IC; Moore law; National Changhua University of Education; area overheads reduction; built-in self-routing scheme; repair rate; three-dimensional integrated circuits; through-silicon vias;
