Title :
100×100 optoelectronic cross-connect interconnects using OPTOBUS
Author :
Ai, Jun ; Li, Yao ; Wang, Ting ; Shum, Kai
Author_Institution :
NEC Res. Inst., Princeton, NJ, USA
fDate :
5/1/1999 12:00:00 AM
Abstract :
This paper demonstrates an OPTOBUS-based fully packaged optoelectronic cross-connect interconnect technique for data communication applications. Optical insertion loss of the compact 100×100 cross-connect interconnect device ranges from 0.4 to 2.9 dB among all possible connections. Optical transmissions with bit error rate (BER) of >10-12 can be maintained at per channel bandwidth of 900 Mb/s. The system is expected to have an aggregated interconnect bandwidth near 100 Gb/s when being fully connected with the OPTOBUS chips
Keywords :
data communication; integrated circuit packaging; integrated optoelectronics; multiprocessor interconnection networks; optical interconnections; optical losses; 100×100 optoelectronic cross-connect interconnects; 900 Mbit/s; MIN; OPTOBUS; OPTOBUS chips; OPTOBUS-based fully packaged optoelectronic cross-connect interconnect technique; aggregated interconnect bandwidth; bit error rate; compact 100×100 cross-connect interconnect device; data communication applications; multiprocessor interconnection networks; optical insertion loss; Bandwidth; Data communication; Integrated circuit interconnections; National electric code; Optical arrays; Optical fiber cables; Optical fiber communication; Optical fiber devices; Optical interconnections; Packaging;
Journal_Title :
Lightwave Technology, Journal of
