• DocumentCode
    1505389
  • Title

    One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration

  • Author

    Zimmer, Fabian ; Lapisa, Martin ; Bakke, Thor ; Bring, Martin ; Stemme, Göran ; Niklaus, Frank

  • Author_Institution
    Fraunhofer Inst. for Photonic Microsyst. (IPMS), Dresden, Germany
  • Volume
    20
  • Issue
    3
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    564
  • Lastpage
    572
  • Abstract
    In this paper, we demonstrate the first high-resolution spatial-light-modulator chip with 1 million tilting micromirrors made of monocrystalline silicon on analog high-voltage complementary metal-oxide-semiconductor driving electronics. This device, as result of a feasibility study, shows good optical and excellent mechanical properties. The micromirrors exhibit excellent surface properties, with a surface roughness below 1-nm root mean square. Actuated micromirrors show no imprinting behavior and operate drift free. Very large-scale heterogeneous integration was used to fabricate the micromirror arrays. The detailed fabrication process is presented in this paper, together with a characterization of the SLM devices. Large arrays of individually controllable micromirrors are the enabling component in high-perfomance mask-writing systems and promising for high throughput deep-ultraviolet maskless lithography systems. The adoption of new materials with enhanced characteristics is critical in meeting the challenging demands with regard to surface quality and operation stability in the future. Very large-scale heterogeneous integration may enable virtually any solid-state material to be integrated together with CMOS electronics.
  • Keywords
    CMOS integrated circuits; VLSI; elemental semiconductors; integrated optics; micro-optomechanical devices; micromirrors; optical arrays; optical control; optical fabrication; silicon; spatial light modulators; surface roughness; CMOS driving electronics; Si; analog high-voltage complementary metal-oxide-semiconductor driving electronics; fabrication process; high throughput deep-ultraviolet maskless lithography; high-perfomance mask-writing systems; high-resolution spatial-light-modulator chip; mechanical properties; one-megapixel monocrystalline-silicon micromirror array; operate drift free; operation stability; optical properties; root mean square; solid-state material; surface properties; surface quality; surface roughness; tilting micromirrors; very large-scale heterogeneous integration; Arrays; CMOS integrated circuits; Metals; Micromirrors; Silicon; Complementary metal–oxide–semiconductor (CMOS) integrated circuits; heterogeneous integration; mirrors; photolithography; silicon; spatial light modulators (SLMs); very large-scale integration; wafer bonding; wafer-scale integration;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2011.2127454
  • Filename
    5756627