• DocumentCode
    1505636
  • Title

    Investigations of rate coefficients in the Cl model

  • Author

    Helmsen, John ; Hammer, David ; Yamartino, John ; Loewenhardt, Peter

  • Author_Institution
    Metal Etch Div., Appl. Mater. Inc., Sunnyvale, CA, USA
  • Volume
    27
  • Issue
    1
  • fYear
    1999
  • fDate
    2/1/1999 12:00:00 AM
  • Firstpage
    58
  • Lastpage
    59
  • Abstract
    Investigations of ion distributions in Cl plasmas in the Applied Materials Decoupled Plasma Source chamber have been undertaken through the use of simulation. The Hybrid Plasma Equipment Model plasma simulation software was employed. These simulations were performed to investigate which reactions may be considered significant in the DPS tool according to the current Cl model. In addition, new reactions that have been proposed internally to explain some experimental results were also tested to determine their significance. One of the reactions that was determined to be significant is Cl+ to Cl2+ charge exchange reaction which influences the ratio of Cl+ ions to Cl2+ ions in the DPS chamber. This reaction may influence the ability of Al etch processes to remove Cu residue
  • Keywords
    charge exchange; chlorine; plasma chemistry; plasma materials processing; plasma production; plasma simulation; reaction rate constants; sputter etching; Al; Al etch processes; Cl; Cl model; Cl plasmas; Cl2; Cl2+; Cl+; Cu; Cu residue; DPS chamber; applied materials decoupled plasma source chamber; charge exchange reaction; hybrid plasma equipment model plasma simulation software; ion distributions; rate coefficients; reactions; simulation; Electrons; Etching; Optical materials; Plasma applications; Plasma materials processing; Plasma measurements; Plasma properties; Plasma simulation; Plasma sources; Testing;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/27.763034
  • Filename
    763034