DocumentCode
1505636
Title
Investigations of rate coefficients in the Cl model
Author
Helmsen, John ; Hammer, David ; Yamartino, John ; Loewenhardt, Peter
Author_Institution
Metal Etch Div., Appl. Mater. Inc., Sunnyvale, CA, USA
Volume
27
Issue
1
fYear
1999
fDate
2/1/1999 12:00:00 AM
Firstpage
58
Lastpage
59
Abstract
Investigations of ion distributions in Cl plasmas in the Applied Materials Decoupled Plasma Source chamber have been undertaken through the use of simulation. The Hybrid Plasma Equipment Model plasma simulation software was employed. These simulations were performed to investigate which reactions may be considered significant in the DPS tool according to the current Cl model. In addition, new reactions that have been proposed internally to explain some experimental results were also tested to determine their significance. One of the reactions that was determined to be significant is Cl+ to Cl2+ charge exchange reaction which influences the ratio of Cl+ ions to Cl2+ ions in the DPS chamber. This reaction may influence the ability of Al etch processes to remove Cu residue
Keywords
charge exchange; chlorine; plasma chemistry; plasma materials processing; plasma production; plasma simulation; reaction rate constants; sputter etching; Al; Al etch processes; Cl; Cl model; Cl plasmas; Cl2; Cl2+; Cl+; Cu; Cu residue; DPS chamber; applied materials decoupled plasma source chamber; charge exchange reaction; hybrid plasma equipment model plasma simulation software; ion distributions; rate coefficients; reactions; simulation; Electrons; Etching; Optical materials; Plasma applications; Plasma materials processing; Plasma measurements; Plasma properties; Plasma simulation; Plasma sources; Testing;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/27.763034
Filename
763034
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