iTEM: a temperature-dependent electromigration reliability diagnosis tool

Author

Teng, Chin-Chi ; Cheng, Yi-Kan ; Rosenbaum, Elyse ; Kang, Sung-Mo

Author_Institution

Avanti Corp., Fremont, CA, USA

Volume

16

Issue

8

fYear

1997

fDate

8/1/1997 12:00:00 AM

Firstpage

882

Lastpage

893

Abstract

In this paper, we present a new electromigration reliability diagnosis tool (iTEM) for CMOS VLSI circuits. Unlike previous electromigration reliability tools, iTEM can estimate the interconnect temperature rise due to joule heating and heat conduction from the substrate using a newly developed lumped thermal model. By including the temperature effect, iTEM provides much more accurate electromigration reliability diagnosis. Moreover, it is computationally efficient, and can analyze circuit layouts containing tens of thousands of transistors on a desktop workstation

Keywords

CMOS integrated circuits; VLSI; electromigration; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; CMOS VLSI circuit; circuit layout; desktop workstation; iTEM; interconnect temperature rise; joule heating; substrate heat conduction; temperature-dependent electromigration reliability diagnosis tool; thermal model; Circuit analysis; Circuit analysis computing; Electromigration; Heating; Integrated circuit interconnections; Semiconductor device modeling; Temperature; Thermal conductivity; Very large scale integration; Workstations;

fLanguage

English

Journal_Title

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Publisher

ieee

ISSN

0278-0070

Type

jour

DOI

10.1109/43.644613

Filename

644613