Title :
Thermal impedance of cooling fins
Author :
Diebold, E. J. ; Luft, Werner
Author_Institution :
International Rectifier Corporation, El Segundo, Calif.
Abstract :
SEMICONDUCTOR DEVICES are often bolted to a metal plate which acts as a cooling fin. This paper shows a determination of optimum design proportions.
Keywords :
Cooling; Heat transfer; Heating; Impedance; Materials; Metals; Rectifiers;
Journal_Title :
Electrical Engineering
DOI :
10.1109/EE.1959.6446204
