Effect of Epoxy Molding Compound on the Electrical Performance of Microelectronic Devices

The epoxy mold compound (EMC) used in encapsulated microelectronic devices affects the thermal, electrical and mechanical performance of the devices. Although many studies have been conducted to test the reliability, thermal and mechanical aspects of the problem not much literature can be found analyzing the impact of the mold compound on the electrical performance of the devices. In this paper we present the results of carefully designed experiments that evaluate the effects of the EMC in the electrical performance of high-power high-frequency laterally diffused metal oxide silicon transistors.