Overmold technology applied to cavity down ultrafine pitch PBGA package

Author

Ouimet, Sylvain ; Paquet, Marie-Claude

Author_Institution

IBM Canada Ltd., Bromont, Canada

Volume

22

Issue

2

fYear

1999

fDate

5/1/1999 12:00:00 AM

Firstpage

123

Lastpage

128

Abstract

The transfer molding technology is normally used for leadframe type packages and chip-up plastic ball grid array (PBGA) packages. This technology has been applied to cavity down PBGA packages where, normally, a liquid epoxy is dispensed by a needle in the cavity in order to cover the device and gold wires without exceeding the solder ball height plane. The new encapsulation approach using transfer molding process as well as the debug/qualification method and results using an ultrafine pitch wirebond PBGA process will be described

Keywords

ball grid arrays; encapsulation; fine-pitch technology; lead bonding; moulding; plastic packaging; cavity down PBGA packages; debug method; encapsulation approach; liquid epoxy; overmold technology; qualification method; solder ball height plane; transfer molding technology; ultrafine pitch wirebond PBGA process; Electronic packaging thermal management; Electronics packaging; Encapsulation; Gold; Integrated circuit interconnections; Integrated circuit packaging; Lead; Plastic packaging; Transfer molding; Wires;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.763182

Filename

763182