Title :
A CMOS image sensor module applied for a digital still camera utilizing the TAB on glass (TOG) bonding method
Author :
Segawa, Masao ; Ono, Michiko ; Musha, Sei ; Kishimoto, Yasukazu ; Ohashi, Akihiro
Author_Institution :
Toshiba Corp., Yokohama, Japan
fDate :
5/1/1999 12:00:00 AM
Abstract :
The world´s smallest (105×55×20 mm) and lightest (130 g) digital still camera has been developed, in which a 330 K pixel complementary metal-oxide-semiconductor (CMOS) image sensor chip is used as an image sensor. The authors have developed a new thinner and smaller image sensor module, called tape automated bonding (TAB) on glass (TOG) module, using the anisotropic conductive paste (ACP) interconnection method. The TOG production process was established by obtaining optimum bonding conditions for both optical glass bonding and CMOS chip bonding to the TAB tape. The bonding conditions including sufficient bonding margins, were mainly studied. The TOG module obtained good imaging properties, It also has a high reliability such as thermal cycle test (-40 to +110°C/30 min, 2000 cycles) and the high temperature storage test (60°C, 90% RH, 3000 h). The stable production process was confirmed by fabricating an automatic bonding machine
Keywords :
CMOS image sensors; cameras; flip-chip devices; integrated circuit packaging; tape automated bonding; wafer bonding; -40 to 110 degC; 330 kpixel; 60 degC; CMOS chip bonding; CMOS image sensor module; TAB on glass; TOG; anisotropic conductive paste; automatic bonding machine; bonding margins; bonding method; digital still camera; high temperature storage test; interconnection method; optical glass bonding; optimum bonding conditions; reliability; thermal cycle test; Anisotropic magnetoresistance; Bonding; CMOS image sensors; Digital cameras; Glass; Image sensors; Image storage; Pixel; Production; Testing;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.763187
