Influence of a floating plane on effective ground plane inductance in multilayer and coplanar packages

Author

Lopez, Michael ; Prince, John L. ; Cangellaris, Andreas C.

Author_Institution

Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA

Volume

22

Issue

2

fYear

1999

fDate

5/1/1999 12:00:00 AM

Firstpage

182

Lastpage

188

Abstract

The impact of a floating metal layer on the effective ground plane inductance has been investigated in both multilayer (ground planes) and coplanar (ground conductors) packages. For the multilayer case, both thick and thin film geometries were examined, and the results were compared to a thin film coplanar configuration. It was seen that the floating plane actually increases the ground plane inductance in the multilayer case and decreases the ground plane inductance in the lead frame case. Examining the current density in the floating and ground plane and the ground´s partial self-inductance and ground-signal partial mutual inductance give a detailed explanation for this phenomenon

Keywords

inductance; packaging; coplanar package; current density; floating metal layer; floating plane; ground conductor; ground plane inductance; lead frame; multilayer package; mutual inductance; self-inductance; thick film; thin film; Coplanar transmission lines; Driver circuits; Equations; Inductance; Noise reduction; Nonhomogeneous media; Packaging; Power system transients; Transistors; Voltage fluctuations;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.763190

Filename

763190