DocumentCode
1506378
Title
On resonant effects in multilayer RF/microwave printed circuit board applications
Author
Georgieva, Natalia ; Chen, Zhizhang ; Oberhammer, Wolfgang
Author_Institution
Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
Volume
22
Issue
2
fYear
1999
fDate
5/1/1999 12:00:00 AM
Firstpage
200
Lastpage
206
Abstract
Multilayer printed-circuit boards (PCB´s) are nowadays widely used in high-frequency technology applications. While their small dimensions, compact design and low cost are an obvious advantage, the impact of full-wave phenomena such as electromagnetic coupling, resonance or leakage increases substantially as the used frequency spectrum shifts toward and beyond the upper UHF band and the L-band (1-2 GHz). Two types of PCB structures exhibiting resonant properties are considered in this paper: PCB shielding covers and large split-ground conducting plates. These structures can cause narrow-band (resonant) cross-talk. Their behavior is studied by both numerical and analytical approaches, and simple techniques to predict possible resonant coupling are proposed
Keywords
UHF circuits; crosstalk; electromagnetic coupling; electromagnetic shielding; microwave circuits; printed circuits; 1 to 2 GHz; L-band; UHF band; crosstalk; electromagnetic coupling; high-frequency technology; multilayer RF/microwave printed circuit board; package resonance; shielding cover; split-ground conducting plate; Circuit simulation; Costs; Coupling circuits; Crosstalk; Microwave circuits; Nonhomogeneous media; Packaging; Printed circuits; Radio frequency; Resonance;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.763192
Filename
763192
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