Frequency response characteristics of reference plane effective inductance and resistance [IC packaging]

Author

Xie, Xuebing ; Prince, John L.

Author_Institution

Intel Corp., Santa Clara, CA, USA

Volume

22

Issue

2

fYear

1999

fDate

5/1/1999 12:00:00 AM

Firstpage

221

Lastpage

229

Abstract

A method which uses the partial element equivalent circuit (PEEC) method and electrical network theory to solve for the effective impedance matrix of reference planes is presented. The convergence and accuracy of the method are checked. The frequency responses of the effective inductance (L_eff(f)) and resistance (R_eff(f)) of reference plane are discussed. The effects of current redistribution and the skin effect on L_eff(f) and R _eff(f) are discussed. The effect of number of sinks and sources is examined

Keywords

convergence of numerical methods; current distribution; electric resistance; equivalent circuits; frequency response; impedance matrix; inductance; integrated circuit packaging; skin effect; convergence; current redistribution; effective impedance matrix; electrical network theory; frequency response characteristics; partial element equivalent circuit method; reference plane effective inductance; reference plane effective resistance; skin effect; Conductors; Electric resistance; Electronics packaging; Frequency response; Impedance; Inductance; Integrated circuit packaging; Semiconductor device noise; Switches; Voltage;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.763195

Filename

763195