Extreme silicon RFICs for phased-array applications

This invited talk will present the latest work on silicon RFICs for phased-array applications with emphasis on very large chips with built-in-self-test capabilities. These chips can drastically reduce the cost of microwave and millimeter-wave phased arrays by combining many elements on the same chip, together with digital control. The chips also allow a much easier packaging scheme using either a multi-layer PCB or wafer-level packages. If available, I will also present a millimeter-wave wafer-scale phased array where the entire phased array is built on a single wafer, with layout crossing over the standard reticle size. Several examples from 30 GHz to 94 GHz will be given, together with their packaging and measured antenna patterns.