DocumentCode :
1506975
Title :
Suppression of the floating-body effect in partially-depleted SOI MOSFETs with SiGe source structure and its mechanism
Author :
Nishiyama, Akira ; Arisumi, Osamu ; Yoshimi, Makoto
Author_Institution :
Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
Volume :
44
Issue :
12
fYear :
1997
fDate :
12/1/1997 12:00:00 AM
Firstpage :
2187
Lastpage :
2192
Abstract :
SiGe layers were formed in source regions of partially-depleted 0.25-μm SOI MOSFETs by Ge implantation, and the floating-body effect was investigated for this SiGe source structure. It is found that the increase of the Ge implantation dosage suppresses kinks in Id-Vd characteristics and that the kinks disappear for devices with a Ge dose of 3×1016 cm-2. The lowering of the drain breakdown voltage and the anomalous decrease of the subthreshold swing are also suppressed with this structure. It is confirmed that this suppression effect originates from the decrease of the current gain for source/channel/drain lateral bipolar transistors (LBJTs) with the SiGe source structure. The temperature dependence of the base current indicates that the decrease of the current gain is ascribed to the bandgap narrowing of the source region
Keywords :
Ge-Si alloys; MOSFET; ion implantation; semiconductor materials; silicon-on-insulator; 0.25 micron; Ge implantation; I-V characteristics; SiGe; SiGe source; bandgap narrowing; current gain; drain breakdown voltage; floating-body effect; lateral bipolar transistor; partially-depleted SOI MOSFET; subthreshold swing; Bipolar transistors; Germanium silicon alloys; Impact ionization; Laboratories; Large scale integration; MOSFET circuits; Oxidation; Photonic band gap; Silicon germanium; Temperature dependence;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.644634
Filename :
644634
Link To Document :
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