Title :
Multigigabit/s operations of 16-wavelength vertical-cavity surface-emitting laser array
Author :
Maeda, M.W. ; Chang-Hasnain, C. ; Von Lehmen, A. ; Izadpanah, H. ; Lin, Chinlon ; Iqbal, M.Z. ; Florez, L. ; Harbison, J.
Author_Institution :
Bellcore, Red. Bank, NJ, USA
Abstract :
A multiple-wavelength 2*8 monolithic surface-emitting laser array with a potential aggregate array capacity of 80 Gb/s is reported. The high-speed packaging for the array was made possible with a slip-chip bonding technique, and each laser was capable of 5 Gb/s operation. The chirp-broadened 20-dB spectral width was less than 0.3 mm and the spectra occupied 16 independent wavelengths. Both optical and thermal crosstalks were very small, and the electrical crosstalk ranged from <-35 dB at <1 GHz, to -10 approximately -30 dB at 5 GHz.<>
Keywords :
crosstalk; laser cavity resonators; laser transitions; packaging; semiconductor laser arrays; 16-wavelength vertical-cavity surface-emitting laser array; 2*8 monolithic surface-emitting laser array; 5 Gbit/s; 80 Gbit/s; aggregate array capacity; chirp-broadened 20-dB spectral width; electrical crosstalk; high-speed packaging; semiconductor; slip-chip bonding technique; thermal crosstalks; Aggregates; Bonding; Chirp; Crosstalk; High speed optical techniques; Optical arrays; Optical surface waves; Packaging; Surface emitting lasers; Vertical cavity surface emitting lasers;
Journal_Title :
Photonics Technology Letters, IEEE
