DocumentCode :
1508050
Title :
Effect of Ion Energy on Power MOSFET´s Oxide Reliability
Author :
Naceur, M. ; Touboul, A.D. ; Vaille, J.R. ; Lorfèvre, E. ; Bezerra, F. ; Chaumont, G. ; Saigné, F.
Author_Institution :
Institut d´´Electronique du Sud, Université Montpellier 2, UMR UM2-CNRS 5214, Montpellier, France
Volume :
59
Issue :
4
fYear :
2012
Firstpage :
786
Lastpage :
791
Abstract :
Heavy ion-induced Power MOSFET´s reliability degradation has been studied. Irradiations were realized at low and high energy with the same electronic stopping power at the surface of the die. For both energies, a decrease of the charge to breakdown has been observed after irradiation. However, an enhanced degradation of the oxide layer reliability is observed at low energy. The lifetime reduction at high energy is correlated to local disorder along the ion track that can act as precursor damage. On the other hand, the most important reliability degradation at low energy is attributed to a synergy effect between ionizing and non-ionizing processes. Clusters of defects can indeed be formed, adding an additional wear-out mechanism. These results may be significant in the frame of Single Event Testing
Keywords :
Degradation; Electric breakdown; Logic gates; Power MOSFET; Radiation effects; Reliability; Stress; Charge to breakdown; High Electrical Field Stress (HEFS); Linear Energy Transfer (LET); Non Ionizing Energy Loss (NIEL); heavy ions; latent defect; power MOSFET; structural modifications; time to breakdown;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2012.2192751
Filename :
6194357
Link To Document :
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