Title :
Quantitative Edge Cross-Section Angle Impact on Conductor Loss
Author :
Vincent, Tracey S. ; Itovich, Yan ; Bar-On, Isa
Author_Institution :
Dept. of Mater. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
fDate :
6/1/2010 12:00:00 AM
Abstract :
This paper describes a method of forming different conductor edge cross-section angles by using thick-film screen printing on substrates of different surface roughness. The edge angle for each surface type is compared visually and measured using an interferometer microscope. The conductor edge angle is correlated to the respective transmission loss sample. The impact of different edge angles on conductor loss is observed.
Keywords :
conductors (electric); dielectric losses; electronics packaging; interferometry; printed circuits; printing; surface roughness; conductor edge cross-section angles; conductor loss edge angle; interferometer microscope; surface roughness; thick-film PCB; thick-film screen printing; Conductor loss; edge angle; surface roughness; surface topography; thick film;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2010.2050380
