Title :
A sub-1-dB NF±2.3-kV ESD-protected 900-MHz CMOS LNA
Author :
Gramegna, Giuseppe ; Paparo, Mario ; Erratico, Pietro G. ; De Vita, Placido
Author_Institution :
STMicroelectronics, Catania, Italy
fDate :
7/1/2001 12:00:00 AM
Abstract :
A sub-1-dB noise figure HBM ESD-protected [-3 kV, 2.3 kV] low noise amplifier (LNA) has been integrated in a 0.35-μm RF CMOS process with on-chip inductors. The sensitivity of the LNA performances to the spread of parasitics associated with package and bondwire has been attenuated by using an inductive on-chip source degeneration. At 920 MHz and Pdc=8.6 mW, the LNA features: noise figure NF=1 dB, input return loss=-8.5 dB, output return loss=-27 dB, power gain G p=13 dB, input IIP3=-1.5 dBm. At a power dissipation of 5 mW and 17.6 mW, a NF respectively equal to 1.2 dB and 0.85 dB is measured. The CMOS LNA takes 12 pins of a TQFP48 package, an area of 1.0×0.66 mm2 (bondwire pads excluded) and it is the first HBM ESD-protected [-3 kV, 2.3 kV] CMOS LNA to break the 1-dB NF barrier
Keywords :
CMOS analogue integrated circuits; UHF amplifiers; electrostatic discharge; packaging; transceivers; -3 kV; 2.3 kV; 900 MHz; CMOS LNA; ESD-protected; HBM pulses; RF CMOS process; TQFP48 package; bias circuit; bondwire; inductive on-chip source degeneration; off-chip tuning; on-chip inductors; parasitics spread; Bonding; CMOS process; Gain; Inductors; Low-noise amplifiers; Noise figure; Noise measurement; Packaging; Radio frequency; Radiofrequency amplifiers;
Journal_Title :
Solid-State Circuits, IEEE Journal of