Title :
System on chip or system on package?
Author :
Tummala, Rao R. ; Madisetti, Vijay K.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The authors propose a new system design paradigm, the system on package, which uses electronic product reengineering to meet time-to-market and performance requirements. The system on package promises a higher return on investment than the system on chip
Keywords :
packaging; systems re-engineering; electronic product reengineering; system design paradigm; system on package; time-to-market; Capacitance; Chip scale packaging; Consumer electronics; Costs; Electronics packaging; Integrated circuit packaging; Law; Legal factors; System-on-a-chip; Wiring;
Journal_Title :
Design & Test of Computers, IEEE
