• DocumentCode
    1509883
  • Title

    System on chip or system on package?

  • Author

    Tummala, Rao R. ; Madisetti, Vijay K.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    16
  • Issue
    2
  • fYear
    1999
  • Firstpage
    48
  • Lastpage
    56
  • Abstract
    The authors propose a new system design paradigm, the system on package, which uses electronic product reengineering to meet time-to-market and performance requirements. The system on package promises a higher return on investment than the system on chip
  • Keywords
    packaging; systems re-engineering; electronic product reengineering; system design paradigm; system on package; time-to-market; Capacitance; Chip scale packaging; Consumer electronics; Costs; Electronics packaging; Integrated circuit packaging; Law; Legal factors; System-on-a-chip; Wiring;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/54.765203
  • Filename
    765203
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1509883