Title :
Thin-film pulse propagation analysis using frequency techniques
Author :
Hwang, Lih-Tyng ; Nayak, Deepak ; Turlik, Iwona ; Reisman, Arnold
Author_Institution :
Microelectron. Center of North Carolina, Research Triangle Park, NC, USA
fDate :
3/1/1991 12:00:00 AM
Abstract :
High-speed pulse (rise time=100 ps) propagation in a thin-film multichip package is analyzed. The thin-film lines are assumed to be 8 μm wide, 4 μm thick, 12 μm above the ground, and made of copper embedded in a dielectric medium with a dielectric constant of 3.5 (e.g., polyimide). Weeks´ algorithm is used to calculate the wideband line characteristics which include the skin effect of conductors and the proximity effect of the ground up to a frequency of 10 GHz. It is assumed that the dielectric imperfection and the conductor surface roughness are negligible. An inverse fast Fourier transform (FFT) algorithm is used to obtain the time-domain results. Line lengths studied ranged from 1 to 15 cm. and three types of terminations are treated: parallel, series, and open. Termination strategy for different line lengths is presented. The maximum line length allowable in the thin-film conductor system is then examined. Finally, crosstalk at various locations of the quiet lines with different terminations is discussed
Keywords :
hybrid integrated circuits; microwave integrated circuits; thin film circuits; transmission line theory; 1 to 15 cm; 10 GHz; 100 ps; 8 micron; Cu stripline; Weeks´ algorithm; crosstalk; frequency techniques; high-speed pulse propagation; inverse fast Fourier transform; line lengths; polyimide; proximity effect; skin effect; termination strategy; thin film pulse propagation analysis; thin-film conductor system; thin-film lines; thin-film multichip package; time-domain results; types of terminations; wideband line characteristics; Conductors; Copper; Dielectric constant; Dielectric thin films; Frequency; Packaging; Polyimides; Skin effect; Transistors; Wideband;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on