• DocumentCode
    151016
  • Title

    Static and dynamic characterization of high power silicon carbide BJT modules

  • Author

    Nawaz, Muhammad ; Nan Chen ; Chimento, Filippo ; Liwei Wang

  • Author_Institution
    ABB Corp. Res., Vasteras, Sweden
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    2824
  • Lastpage
    2831
  • Abstract
    Silicon carbide (SiC) based power semiconductor devices are now considered as key components for future power applications where high power density, high temperature and high ruggedness against radiation are key parameters. This thanks to lower conduction and switching losses offered by the SiC devices. This paper deals with static and dynamic measurements performed for SiC based BJTs (Bipolar Junction Transistors) power modules with voltage rating 1200 V and current rating 800 A. The power modules are fabricated in flexible half bridge configuration in order to allow either full power module with 2400 V and 800 A as one power switch or by using two parallel 1200 V and 400 A half bridge legs. Results from engineering samples show overall good confidence as promised by the manufacturer for most of the transistor samples. A 40-50% reduction in the current gain was observed when temperature was increased to 475K as expected. Bipolar devices have been found out fairly stable under continuous static operation at nominal current levels.
  • Keywords
    bipolar transistors; silicon compounds; SiC; bipolar junction transistors; current 400 A; current 800 A; high power silicon carbide BJT modules; power semiconductor devices; voltage 1200 V; voltage 2400 V; Junctions; Multichip modules; Silicon; Silicon carbide; Temperature measurement; Transistors; Voltage measurement; 4H-SiC BJTs; Bipolar Junction Transistors; Power Semiconductor Modules; Silicon Carbide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
  • Conference_Location
    Pittsburgh, PA
  • Type

    conf

  • DOI
    10.1109/ECCE.2014.6953781
  • Filename
    6953781