DocumentCode
151019
Title
Analysis on reverse recovery characteristic of SiC MOSFET intrinsic diode
Author
Zhaohui Wang ; Jiajia Ouyang ; Junming Zhang ; Xinke Wu ; Kuang Sheng
Author_Institution
Coll. of Electr. Eng., Zhejiang Univ., Hangzhou, China
fYear
2014
fDate
14-18 Sept. 2014
Firstpage
2832
Lastpage
2837
Abstract
Different from IGBT, SiC MOSFET can operate as synchronous rectifier with low on resistance, thus the intrinsic diode only work during the dead time. To utilize the intrinsic diode as freewheeling diode, the reverse recovery characteristic is analyzed and discussed in this paper. Four operating conditions, i.e. turn-off voltage, forward current, current commutating slope and junction temperature, are considered to evaluate the turn-off performance of SiC MOSFET intrinsic diode. To test the device and minimize the stray inductance, a double pulse test bench based on direct bond copper substrate and bare dies is designed. The reverse recovery feature of two kinds of silicon p-i-n diode is also tested for comparison. The experimental results show that the intrinsic diode is sensitive to the junction temperature and the performance gets worse at high temperature, but still much better than silicon p-i-n diode.
Keywords
carbon compounds; elemental semiconductors; p-i-n diodes; power MOSFET; rectifiers; silicon compounds; SiC MOSFET intrinsic diode; bare dies; current commutating slope; direct bond copper substrate; double pulse test bench; forward current; freewheeling diode; junction temperature; reverse recovery characteristic analysis; reverse recovery feature; silicon p-i-n diode; stray inductance minimization; synchronous rectifier; turn-off performance evaluation; turn-off voltage; Junctions; Logic gates; MOSFET; P-i-n diodes; Resistance; Schottky diodes; Silicon carbide;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
Conference_Location
Pittsburgh, PA
Type
conf
DOI
10.1109/ECCE.2014.6953782
Filename
6953782
Link To Document