DocumentCode :
151088
Title :
Rogowski current sensor design and analysis based on printed circuit boards (PCB)
Author :
Ruxi Wang ; Prabhakaran, Suraj ; Burdick, Williams ; Nicholas, Raymond
Author_Institution :
Gen. Electr. Global Res., Niskayuna, NY, USA
fYear :
2014
fDate :
14-18 Sept. 2014
Firstpage :
3206
Lastpage :
3211
Abstract :
This work presents a new Rogowski current sensor design implemented in printed circuit boards. The proposed structure utilizes a modular design for a variety of applications. Feasibility was first demonstrated using standard printed circuit boards. Test results detail performance with high repeatability with less than 0.8% difference in sensed voltages and less than 0.3% difference in sensed voltages with respect to position of installation. In order to have a less complex, more manufacturable and modular Rogowski current sensor, a flexible printed circuit (FPC) solution was also designed and demonstrated. By using the FPC solution, high sensitivity and much higher power density was achieved. Coupling analysis of a 3-phase system was also conducted both from simulation and experiments.
Keywords :
electric sensing devices; printed circuits; sensitivity; 3-phase system; FPC solution; PCB; Rogowski current sensor analysis; Rogowski current sensor design; coupling analysis; flexible printed circuit Board; power density; Assembly; Coils; Conductors; Couplings; Flexible printed circuits; Sensitivity; Spirals; Current Sensing; Flexible PCB; High Repeatability; Rigid PCB;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
Conference_Location :
Pittsburgh, PA
Type :
conf
DOI :
10.1109/ECCE.2014.6953836
Filename :
6953836
Link To Document :
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