DocumentCode :
1511757
Title :
Differential Via Modeling Methodology
Author :
Simonovich, Lambert ; Bogatin, Eric ; Cao, Yazi
Author_Institution :
Lamsim Enterprises Inc., Stittsville, ON, Canada
Volume :
1
Issue :
5
fYear :
2011
fDate :
5/1/2011 12:00:00 AM
Firstpage :
722
Lastpage :
730
Abstract :
This paper describes a novel method of modeling the differential via on multilayered printed circuit boards (PCBs) used in high-speed digital designs based on the analytical equations for characteristic impedance and effective dielectric constant. In the absence of measured or electromagnetic simulated data traditionally needed to extract these parameters, this method can quickly and efficiently predict the behavior of the differential via holes on PCBs using a circuit simulator.
Keywords :
integrated circuit modelling; permittivity; printed circuit design; analytical equation; characteristic impedance; circuit simulator; dielectric constant; differential via modeling methodology; electromagnetic simulated data; high-speed digital design; multilayered printed circuit board; Capacitance; Dielectric constant; Impedance; Inductance; Integrated circuit modeling; Mathematical model; Resonant frequency; Circuit modeling; circuit simulation; via modeling;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2010.2103313
Filename :
5764826
Link To Document :
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