Title :
Differential Via Modeling Methodology
Author :
Simonovich, Lambert ; Bogatin, Eric ; Cao, Yazi
Author_Institution :
Lamsim Enterprises Inc., Stittsville, ON, Canada
fDate :
5/1/2011 12:00:00 AM
Abstract :
This paper describes a novel method of modeling the differential via on multilayered printed circuit boards (PCBs) used in high-speed digital designs based on the analytical equations for characteristic impedance and effective dielectric constant. In the absence of measured or electromagnetic simulated data traditionally needed to extract these parameters, this method can quickly and efficiently predict the behavior of the differential via holes on PCBs using a circuit simulator.
Keywords :
integrated circuit modelling; permittivity; printed circuit design; analytical equation; characteristic impedance; circuit simulator; dielectric constant; differential via modeling methodology; electromagnetic simulated data; high-speed digital design; multilayered printed circuit board; Capacitance; Dielectric constant; Impedance; Inductance; Integrated circuit modeling; Mathematical model; Resonant frequency; Circuit modeling; circuit simulation; via modeling;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2010.2103313