Title :
Effects of Barrier Thinning on Small-Signal and 30-GHz Power Characteristics of AlGaN/GaN Heterostructure Field-Effect Transistors
Author :
Higashiwaki, Masataka ; Pei, Yi ; Chu, Rongming ; Mishra, Umesh K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA, USA
fDate :
6/1/2011 12:00:00 AM
Abstract :
Short-gate AlGaN/GaN heterostructure field-effect transistors (HFETs) with extremely thin AlGaN barrier layers were fabricated and characterized from the viewpoint of millimeter-wave applications. The devices showed good direct current and small-signal characteristics; however, the 30-GHz power characteristics were degraded due to frequency dispersion caused by the SiNx/AlGaN interface states. The dispersive behavior of the thin barrier devices measured in pulse I-V curves was different from the commonly observed one for the devices with normal AlGaN barrier thicknesses of 20-30 nm. The first characteristic point was that it happened only for structures with extremely thin barrier layers. As another unique point, the drain current collapse in the pulsed modes was observed only at a positive gate bias. We consider that the unique dispersion of the thin barrier HFETs was caused by the different charging paths related to hot electrons accelerated in a high electric field region of a 2-D electron gas (2DEG) channel. It seems reasonable to suppose that, for the extremely thin barrier structures, the AlGaN surface states can be charged not only by injected electrons from the gate metal through the SiNx/AlGaN interface but also by the hot electrons overcoming the barrier from the 2DEG formed at the AlGaN/GaN interface.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; hot electron transistors; millimetre wave field effect transistors; silicon compounds; 2D electron gas channel; AlGaN-GaN; SiNx-AlGaN; barrier thinning; dispersive behavior; frequency 30 GHz; frequency dispersion; heterostructure field-effect transistor; hot electron; millimeter-wave application; power characteristics; size 20 nm to 30 nm; thin barrier device; Aluminum gallium nitride; Dispersion; Gallium nitride; HEMTs; Logic gates; MODFETs; 30 GHz; Current collapse; GaN; current-gain cutoff frequency $f_{T}$; dispersion; heterostructure field-effect transistor (HFET); load pull; maximum oscillation frequency $f_{max}$; surface states;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2011.2131653