DocumentCode
1513191
Title
A rule-based VLSI process flow validation system with macroscopic process simulation
Author
Funakoshi, Kiyohiko ; Mizuno, Kazushi
Author_Institution
Hitachi Central Res. Lab., Tokyo, Japan
Volume
3
Issue
4
fYear
1990
fDate
11/1/1990 12:00:00 AM
Firstpage
239
Lastpage
246
Abstract
As the integration scale of very large-scale integration (VLSI) circuits increases, it is becoming increasingly difficult to design long and complex process flows because there is a great amount of knowledge required in VLSI process technology. To assist in process-flow design, a rule-based validation system has been developed. This system checks designed process flows by using process knowledge related to contamination, cleaning methods, and the various constraints between the wafer structure and the process or equipment. It can point out error conditions that lead to such destructive results as contamination of the process equipment. The system applies process knowledge, expressed as if/then rules, to the process conditions and to macroscopic wafer structures derived from rule-based simulation. Due to the complexity of VLSI multilayered structures, information related to wafer structure is very important. This information can be obtained by rule-based simulation of such various macroscopic attributes of wafer structure as substance, contamination, and layer thickness. The validation system can precisely check various process flows and substantially improve the efficiency and quality of process-flow design
Keywords
VLSI; computerised monitoring; digital simulation; electronic engineering computing; expert systems; integrated circuit manufacture; manufacturing computer control; process computer control; VLSI process flow validation system; cleaning methods; contamination; error conditions; if/then rules; macroscopic process simulation; macroscopic wafer structures; multilayered structures; process knowledge; rule-based simulation; rule-based validation system; very large-scale integration; Circuit simulation; Cleaning; Computer errors; Contamination; Design engineering; Furnaces; Laboratories; Oxidation; Process design; Very large scale integration;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.61973
Filename
61973
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